Influence of pumice powder on some properties of phenol-formaldehyde bonded particleboards

Abstract

In this study, pumice powder as a volcanic aggregate was added in the particleboards' production. The effect of various ratios of pumice powder (10%, 20%, 30%, and 40%) on physical, mechanical, thermal and fire resistance properties was investigated. Pumice powder did not significantly affect particleboards' water absorption and thickness swelling values. However, the mechanical properties were significantly affected with raising pumice powder content. The modulus of rupture and modulus of elasticity decreased up to 46% and 45%, respectively. There was also a decrease in the internal bond strength up to 42%. Conversely, pumice powder improved the thermal degradation temperatures. The onset temperatures increased with increasing pumice powder content above 300°C. Similarly, the pumice powder improved the fire resistance of particleboards up to 7% compared to control samples.